Always Be Curious #220: Inside the Apple M4 chip, TSMC's packaging, and AI hallucinations

This week in ABC: TechInsights takes a peek under the hood of Apple M4, TSMC is doing some pioneering work in packaging, and AI can be a bit cooky.

📅 I’m unplugging from intarwebz for a bit, so the next ABC publishes Sun 7 July

This week, advanced chip packaging was once again in the spotlight with rumors about TSMC’s research into rectangular panel-like substrates. As far as rumors go, it’s not far-fetched: both Intel and Samsung have confirmed to be researching new ways of packaging chips, includ…